Power electronics devices are now widely used to efficiently deliver electrical power in hybrid/electric cars, home electronics, telecommunication, and so on. Large heat accompanied with these power electronics should be transmitted to the heat sink. In the present study, cooling technologies based on heat sink with different material and thermal properties. High cooling performance can manage junction temperatures to achieve goals for system efficiency, product cost, and system reliability. Cooling technologies depend on heat spreading and moving by heat conduction associated with convection. Usually, natural or forced air cooling heat sink provides efficient heat spreading.
Thermal stress of electronics PCB is affected by thermal expansion in interconnection with different material. In the present study, pin fin heat sinks of different materials were investigated in terms of 3 dimensional thermal conductivity allocation. In this analysis, the cooling performance was observed in three terms of chip junction temperature variation. heat sinks made of usual metallic materials such as Copper and Aluminum were compared with heat sinks of orthographic thermal conductivity composite materials. The pin-fin heat sink of kx-ky-kz = 810-52-810 W/m-K composite material shows slightly higher thermal performance. The optimum heat sink design should be accompanied with special care on thermal conductivity allocation in three dimensional directions.